Hysol
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When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel’s widely acclaimed Hysol® line of products is without compare.
Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.
The Hysol line of products also complies with the latest environmental legislation, delivering “Green” and lead-free compatible materials as the industry moves toward more environmentally-friendly manufacturing.
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Electronics & electrical devices
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Electronics assembly
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Printed circuit board assembly (PCB)
Henkel’s line of Multicore® Solder Materials, Loctite® surface mount adhesives, CSP Underfills and circuit protection materials delivers the performance, reliability and material set compatibility required to meet the diverse manufacturing needs of today’s leading electronics companies. -
Electronics & electrical devices
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Electronics assembly
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Printed circuit board protection (PCB)
Henkel offers a full suite of PCB protection products including conformal coatings that keep moisture, humidity and other adverse conditions from deteriorating printed circuit boards used in harsh applications and potting and encapsulation compounds that provide full environmental resistance -
Electronics & electrical devices
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Electronics assembly
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Semiconductor assembly
Henkel’s semiconductor products, which include package level underfills, mold compounds and die attach materials are world-renowned for their performance, reliability and outstanding capabilities even in the face of changing manufacturing conditions such as lead-free. -
Transportation
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Aerospace
The aerospace group of Henkel is a leader in structural assembly and metal surface treatment solutions. -
Transportation
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Aerospace
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Aircraft composite assemblies
Henkel provides a variety of product solutions which facilitate the manufacture of composite assemblies in aircraft ranging from wing flaps, leading edges, rudder assemblies, wing to body fairings, trailing edges and ailerons. -
Transportation
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Aerospace
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High temperature assembly
Henkel provides film adhesives and primers along with paste adhesive for engine nacelle assembly. They are designed to withstand the rigors of continuous high temperature operating environments and meet the demands of jet engine manufacturers, engine nacelle producers and commercial aircraft manufacturers. -
Transportation
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Aerospace
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Honeycomb & metal assembly
In the Honeycomb and Metal Assembly segment, Henkel offers metal bonding films for original construction and repair qualified to all major aerospace specifications, toughened paste adhesives used for bonding, potting and filling and syntactic films and pastes. -
Transportation
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Automotive
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Automotive electronics
There are hundreds of different ways in which Loctite adhesives and sealants can enhance the quality and efficiency of motors and generators, particularly in the three major motor sub-components: the rotor, stator and housing, Henkel products provide reliable performance. -
Transportation
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Automotive
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Chassis & wheel
Henkel offers numerous solutions for automotive chassis and wheel applications. These applications include pretreatment of metal chassis components as well as stamping, forming and machining of chassis components and wheels. -
Transportation
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Automotive
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Interior
Henkel is a single source for automotive interior solutions including adhesives, sealants, lubricants and surface treatments that ensure excellent vehicle fit-to-finish. Henkel provides global design, engineering and assembly solutions to the makers of automotive interior systems and components.
