When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel’s widely acclaimed Hysol® line of products is without compare. 

Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes.  From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.

The Hysol line of products also complies with the latest environmental legislation, delivering “Green” and lead-free compatible materials as the industry moves toward more environmentally-friendly manufacturing.